November 10, 2012
Unfortunately, there are 2 dies attached face-to-face, and we were unable to separate them without crushing them into pieces.
Let us know if you know how to separate such attached dies.
November 4, 2012
October 21, 2012
AMD Palce16V8h is an 32x64 array of AND elements.
Die size - 2434x2079µm, 1µm technology.
September 30, 2012
Die size - 3446x2252µm, technology node 1µm.
September 23, 2012
Die size - 2855x2795µm, technology node 500nm.
September 17, 2012
Die size - 2854x3123µm.
September 8, 2012
500nm technology node.