ZeptoBars - RSS feed http://zeptobars.com/en/ Microelectronics. Die-shots. Artificial intelligence. Lasers. en-us Tue, 10 Jun 2006 04:00:00 GMT Tue, 28 Feb 17 01:37:14 +0300 webmaster@zeptobars.com 120 10 <![CDATA[Hitachi HA17555 : weekend die-shot]]> http://zeptobars.com/en/read/Hitachi-HA17555-555-timer Die size 747x762 µm.



For some reason different die sample had significantly different color:

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Sun, 19 Feb 17 06:33:37 +0300
<![CDATA[National LM394CH - super matched BJT : weekend die-shot]]> http://zeptobars.com/en/read/National-LM394CH-super-matched-bjt
Die size 1449x1347 µm.



Chip is soldered to ceramic substrate holder:
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Thu, 16 Feb 17 23:37:06 +0300
<![CDATA[Espressif ESP32 - integrated Wi-Fi transceiver: weekend die-shot]]> http://zeptobars.com/en/read/Espressif-ESP32-Wi-Fi-Bluetooth-2.4Ghz-ISM Espressif ESP32 sets the new level for widely available WiFi/Bluetooth transceivers. Now with 2x LX108 CPU core and 520kB RAM. Surprisingly - includes integrated hall sensor. Manufactured on TSMC 40nm ULP technology. Huge upgrade over their previous highly successful ESP8266.

Hopefully next time we'll see their take on 5.8GHz ISM band.

Die size 2960x2850 µm (~double the area of ESP8266).



Closer look at RF part - some parts resemble ESP8266:


Thanks for the chips and modules to Espressif .]]>
Sun, 05 Feb 17 03:04:45 +0300
<![CDATA[Analog Devices AD584 - precision voltage reference : weekend die-shot]]> http://zeptobars.com/en/read/AD584-reference-analog-devices Analog Devices AD584 is a voltage reference with 4 outputs : 2.5, 5, 7.5 and 10V. Tempco is laser trimmed to <15ppm/°C and voltage error to ~0.1%.


Die size 2236x1570 µm.

One can refer to a die photo from AD datasheet showing a bit older design of the same chip:

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Fri, 27 Jan 17 00:01:04 +0300
<![CDATA[Vishay TSOP4838 - IR receiver module : weekend die-shot]]> http://zeptobars.com/en/read/Vishai-TSOP4838-IR-receiver-Remote-Control Vishay TSOP4838 - decodes IR commands sent with 38kHz modulation. This modulation (and narrow-band filter on receiver module) is required to eliminate ambient light sources which could flicker somewhere at 50-100Hz or 20-30kHz (bad CFL/LEDs). Black (IR transparent) plastic also helps with background noise.


Die size 590x594 µm.

Photodiode is on a separate die:

Die size 1471x1471 µm]]>
Mon, 16 Jan 17 17:37:37 +0300
<![CDATA[ST USBLC6-2 - USB protection chip : weekend die-shot]]> http://zeptobars.com/en/read/ST-USBLC6-2-USB-protection-diode-zener ST USBLC6-2 has 4 diodes and 1 Zener to protect your USB gear.
Die size 1084x547 µm.


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Mon, 26 Dec 16 00:01:11 +0300
<![CDATA[LM338K - 5A LDO in TO-3 : weekend die-shot]]> http://zeptobars.com/en/read/LM338K-5A-LDO-TO-3-TO-220

Die size 1834x1609 µm.

You can see why this giant package is nearly obsolete these days (it's been around since 1955) - tiny crystal on a large steel case is largely limited by steel thermal conduction. Modern packages with copper base could do better with much smaller packages.


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Sun, 18 Dec 16 17:03:54 +0300
<![CDATA[DTA143ZK - PNP BJT with bias resistors : weekend die-shot]]> http://zeptobars.com/en/read/DTA143ZK-PNP-BJT-bias-resistors-rohm-jcst Infinion BCR185W there are no even bias resistors under the pads, hence larger die size (426x424 µm).


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Sun, 18 Dec 16 01:10:06 +0300
<![CDATA[LM1813 - early anti-skid chip : weekend die-shot]]> http://zeptobars.com/en/read/LM1813-National-Semiconductor-anti-skid-Ford-Bob-Miller
Die size 2234x1826 µm.



Test chips on the wafer:


Thanks for the wafers goes to Bob Miller, one of designers of this chip. ]]>
Thu, 15 Dec 16 14:01:26 +0300
<![CDATA[CD4049 - hex CMOS inverter : weekend die-shot]]> http://zeptobars.com/en/read/CD4049-cmos-inverter-metal-gate
Die size 722x552 µm.


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Sat, 03 Dec 16 18:27:00 +0300