December 29, 2013

Invensense MPU6050 6-axis MEMS IMU : weekend die-shot

MEMS is probably the most requested thing we are asked about. Year ago we unsucesfully tried to take a photo of MPU6050. Now it's time for revenge!

Invensense MPU6050 is an integrated gyroscope and accelerometer with 16-bit readings. It contains 2 dies, soldered/welded face-to-face in multiple places (that's what was causing us troubles last time, required temperature for separation exceeded 600C).



On the overview photo you can see how not-flat they are. On a bigger die MEMS part is 28µm above surface, on smaller die - 100 µm above. Also, there is logic right under MEMS on the bigger die.


Size of big die is 2782x2718 µm, small die - 2778x2195 µm.

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December 23, 2013

1645RT2U - Milandr radhard antifuse ROM : weekend die-shot

1645RT2U - radhard 32k*8 antifuse ROM, designed by Milandr. Die size - 8232x8973 µm.
Minimal observed half-pitch - 680nm.



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November 4, 2013

LM2940L 1A LDO regulator : weekend die-shot

UTC LM2940L-5.0 - 1A low-dropout linear regulator.
Apparently 5 contacts at the bottom-right were used to fine-tune output voltage by burning fuses between them.


October 29, 2013

KR1858VM3 - last soviet Z80 : weekend die-shot

KR1858VM3 - is the last soviet Z80. This part was manufactured on Belorussian "Transistor" fab in 1995.

While previous soviet Z80 were NMOS ones, this is 2µm CMOS. But due to "relaxed" layout (in addition to intrinsic lower logic density in CMOS) die size is even larger than 4µm NMOS variant KR1858VM1.

Die size 5050x4657 µm.

October 6, 2013

KR1858VM1 - soviet Z80 : weekend die-shot

KR1858VM1 - Z80-compatible CPU, manufactured in USSR. Die marking "U880/6" suggests that it was also designed in east Germany company VEB Mikroelektronik "Karl Marx" in Erfurt (MME). Compared to T34VM1 die size is shrunk by a factor of 1.6, reworked IO.

Also, you can compare it to MME Z80A and Zilog Z80.

Die size 3601x3409 µm.


October 5, 2013

Fairchild 74F109PC - dual JK flip-flop : weekend die-shot

Fairchild 74F109PC - dual JK flip-flop, part of fastest bipolar 7400 TTL family - F.

Die size 1436x1255 µm.


September 16, 2013

Playstation 1 - MIPS R3051 CPU : weekend die-shot

Playstation 1 CPU - CXD8530CQ based on 33.8688 MHz MIPS R3051 core manufactured at 800nm technology, 3 layers of metalization.

CPU designed by LSI Logic Corp. Die size 8.15x8.1 mm.



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