February 11, 2025
February 1, 2025

TI RM4136D - quad opamp µA741 : weekend die-shot

TI RM4136D misses offset adjustment feature of µA741. Center pad makes routing easier, but was quite rare at the time. One can see needle marks on most pads left after testing.
Die size 2510x1549 µm.


December 1, 2024

ASMedia ASM3242 - PCIE to USB3.2 host controller : weekend die-shot

ASMedia ASM3242 is a 4-line PCI Express Gen3 to single USB3.2 20Gbps host controller.
Die size 3719x3937um. Thanks for the ASMedia chip collection to cyrozap!


November 17, 2024

Siliconix DG190BP - dual SPDT JFET analog switch : weekend die-shot

Siliconix DG190BP is a rare example of having multi-chip assembly inside DIP-16 ceramic package. Just like in modern multi-chip assemblies, it was used to reach maximum product performance per $ by utilizing different manufacturing processes for different dies + offer product variability for the same silicon design. JFET's in DG190 have RDSon of 30 Ohm. Siliconix had different variation of this product with different JFET dies (which lead to different switching speed/resistance combinations). Siliconix was later acquired by Vishay.

Main die size 1113x2027 µm.


October 30, 2024

Chinese F-91W homage quartz watch : weekend die-shot

Chinese F-91W quartz watch is very similar to Casio F-91W, but fortunately does not misuse Casio trademark. Chip is 4 times smaller in Chinese version, it looks simpler, purely digital.

PCB is optimized for cost to an extreme : everything that can be integrated is integrated. There is not even a decoupling capacitor which is probably ok for digital circuits with low slew rate.

Die size 1384x1245 µm.



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