June 11, 2016

OPUS Microsystems OP-6111 - MEMS 2D scanner : weekend die-shot

OPUS Microsystems OP-6111 is a sensor-less resonant 2D-tilting MEMS mirror for application requiring laser scanning (laser projectors, 3D scanning, photoresist exposure e.t.c). Electrostatic actuator.

Die size 3688x3180 µm, mirror is 1000 µm in diameter.

May 22, 2016

Silicon Labs Si8641 - quad channel digital isolator : weekend die-shot

Silicon Labs Si8641 uses capacitive coupling to implement digital isolation (up to 5kV, this model 2.5kV) as speeds of up to 1 Mbps.
This particular model (Si8641AB) contains 2 identical dies, apparently configured by bonding some of the pads on the sides.

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May 11, 2016

You can now support Zeptobars at Patreon and more

We are running this blog for more than 3 years with no monetization of any kind (advertisements, merchandise and such) but from time to time people kept asking on how to help us. From the other side - we've probably reached the limits of our resources to improve the quality of our lab/imaging setup, and we'll need your help to move further.

We've finally outlined a number of voluntary ways you can support our efforts to produce higher-quality microchip photographs for curiosity and education.

Basically, there are 4 ways - spread the word, send us few cool chips for future work, support us at our Patreon campaign (which would allow you to schedule small contribution for each new die shot we publish) or send us some Bitcoins (or use good old Paypal).

Either way content of this blog will remain free for everyone and it will continue to be licensed under permissive CC BY 3.0 license.
May 10, 2016

ST HCF4056 - BCD to 7 segment : weekend die-shot

ST HCF4056 is a CMOS BCD to 7 segment decoder/driver with strobed latch.

May 3, 2016

Maxim ds2401z - serial number chip : weekend die-shot

Dallas Semiconductor/Maxim DS2401 is a factory pre-programmed silicon serial number chip.
Right at the center of the die you can see 64-bit laser-trimmed ROM. Die size 1346x686 µm.

April 16, 2016
April 16, 2016

NXP/Philips BC857BS - dual pnp BJT : weekend die-shot

SOT-363 package contains 2 separate identical transistor dies.
Size of each die is 285x259 µm.