March 24, 2013

GLONASS module Geos-3 : Weekend die-shot

Geos-3 - GLONASS module, designed by R&D Center "GeoStar navigation" Ltd..
PCB has 3 chips: K1905VM1JA designed by Federal State Unitary Enterprise "Microelectronic Research Institute "Progress", SiGe RF-frontend GEOS2RF designed by Saphyrion and 4-mbit serial flash memory MX25U4035Z.


After metallization etch:



This chip has copper metallization. Any suggestions on how to nicely etch Cu/TiN metallization are very welcome.

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