June 1, 2018

Ti SE555P - 1996 version in glass-filled DIP package: weekend die-shot

Some time ago we've seen Ti's 555 from 2006. This is an older one, from 1996. Die here is slightly larger, transistors are square vs round and no pads in the middle of the chip.

Die size 1000x1020 µm.

Another interesting feature of many precision analog parts (including this one) - is glass-filled plastic package, which is a little painful to etch. It is more stable and have lower CTE than plain plastic - robust and economical alternative to metal-ceramic package. Glass particles here are mainly in the range from 7 to 35µm.