Siliconix DG190BP - dual SPDT JFET analog switch : weekend die-shot

Siliconix DG190BP is a rare example of having multi-chip assembly inside DIP-16 ceramic package. Just like in modern multi-chip assemblies, it was used to reach maximum product performance per $ by utilizing different manufacturing processes for different dies + offer product variability for the same silicon design. JFET's in DG190 have RDSon of 30 Ohm. Siliconix had different variation of this product with different JFET dies (which lead to different switching speed/resistance combinations). Siliconix was later acquired by Vishay.

Main die size 1113x2027 µm.